Dongguan: Biwin plans RMB4.5 billion expansion
Biwin plans to invest RMB4.5 billion in a third phase of its advanced semiconductor packaging and testing project in Dongguan’s Songshan Lake, Securities Times reported this week. The proposed expansion includes RMB4 billion in fixed assets, with that investment scheduled for completion by December 2029. Construction would use existing project land. Earlier phases had completed or begun equipment installation but remained in customer validation and small-scale trial production, without mass-production revenue. The company warned that market conditions and implementation risks could affect completion and returns. Biwin also operates a packaging and testing facility in neighboring Huizhou through its Tailai subsidiary.
Leave a reply
You must be logged in to post a comment.






















